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CAES
Colorado Springs, CO, United States
30+ days ago
CAES
Colorado Springs, Colorado, United States
30+ days ago

Description

We are CAES, a technologically advanced electronics company employing more than 3,600 talented makers, thinkers, innovators, and doers nationwide. We build things that solve challenging problems from deep space to the depths of the ocean. We serve customers in defense, aerospace, security, medical, and industrial markets.

 

Are you searching for a career with a company that offers challenging, diverse projects and opportunities? Are you looking for a position with a company that is growing and able to offer long-term professional advancement? Searching for a company that values a friendly work environment and that values YOU? Consider CAES. #peoplefocusedmissiondriven 

 

A career with CAES is more than just a job, it is the pathway to a bright future. 

The Engineering Department of CAES has an opening for a PRINCIPAL PACKAGING ENGINEER in our beautiful Colorado Springs, CO location.  We offer competitive wages, benefits from day 1, a work schedule with every other Friday off, tuition reimbursement, generous PTO and 11 paid holidays per year.   POSSIBILITY for partial remote work depending on responsibilities and project deadlines. 

 

Under limited supervision, the Integrated Circuit (IC) Package Design and Simulation Engineer will perform a variety of routine to complex duties associated with designing suitable packages for semiconductor products. The IC Package Design and Simulation Engineer will also perform a variety of routine to complex duties in support of manufacturing process development and process improvement efforts related to new as well as existing manufacturing projects for analog and/or mixed signal integrated circuits. An exciting opportunity to work within System-in-Package (SiP), Heterogeneous Integration (HI), Chiplets, Fan-Out Wafer Level Packaging (FOWLP), Advanced nodes, USR/XSR, Thermo-Compression Bonding (TCB), Direct Bond Interconnect (DBI).

Essential Duties:

  • Frequently responsible for coordinating and developing feasibility to perform on new product, this includes development schedule, time, cost, and materials for IC package activities.
  • Occasionally responsible for coordinating the work activities of other personnel, cross training and mentoring.
  • On a daily basis, perform package and design related activities which ensure adequate packaging strategies as needed for the product’s intended application. 
  • Work with suppliers to select the best substrates, materials, interconnects and lids based on product requirements and work with vendors to obtain quotes from suppliers and select preferred vendors for package materials as needed for new product development procurement of materials.
  • Perform CAD functions to document designs in conjunction with supplier engineering functions. 
  • Perform thermal, mechanical and parasitic modeling as needed to support product performance requirements. 
  • Maintain the package design library for product families.  
  • Work in conjunction with Process Engineering to ensure and/or improve manufacturability aspects of assembled products.
  • Perform CAD work using applications such as SolidWorks, Pro-E, Auto CAD or MicroStation, ICEMAX, Cadence APD. 
  • Co-fired ceramic and Organic (laminate) package design understanding, and familiarity with MIL-PRF-38535 and JEDEC standards and requirements. 
  • Perform power and signal integrity analysis on IC package designs.
  • Improve and/or Develop Integrated Circuit (IC) related assembly processes and packages for analog and/or mixed signal integrated circuits.  
  • Develop package solutions directly with customers to understand and define the product requirements.   Select appropriate material sets, conduct experiments and develop manufacturing processes to meet quality and reliability targets for the product. 

 

Other Duties:

  • Participate with IC Design Engineering to understand the package performance requirements of IC product developments.  
  • Work with Process Engineering to establish, improve and incorporate package design guidelines for ease of assembly and/or manufacturability.    
  • Perform research and consulting services for PDT and customer packaging requirements.  
  • Provide customer support as needed, participate in product / package design reviews, create and/or review and approve manufacturing, procurement, design and quality documents as assigned.  
  • Actively work to improve modeling capabilities and accuracy by working with suppliers, material property experts and experimental data.
  • Identify and implement process improvements while continuously working to improve core competencies, DfM design for manufacturing plans.
  • Occasionally travels to customers’ or potential customers’ facilities to participate in customers’ New Product Introduction NPI design reviews.
  • Provide technical inputs to Product Development Teams.  
  • Utilize CAD design tools to perform Thermal and Mechanical modeling, design fixtures and hardware, track progress and publish reports as part of this job function.      
  • Maintain a thorough understanding of manufacturing equipment in order to support the development of cost effective and efficient manufacturing processes.  
  • Conduct and/or support Failure Analysis efforts to determine root cause and implement effective corrective action to address manufacturing issues. 
  • Experienced problem solving and analytical skills are essential working within a design environment on component, circuits, and hardware applications. A good understanding of circuit level schematics for IC validation and specification verification. 


Requirements

MINIMUM:

  • Bachelor’s degree in Engineering with Eight (8) + years of IC Packaging experience.
  • OR Master’s degree in Engineering with Five (5) + years of IC Packaging experience.
  • This position requires access to technology, materials, software or hardware that is controlled by US export laws. In order to be eligible for this position, you must be a “US Person” under US export laws (or eligible for approval under a U.S. Government export license).
  • Ability to obtain and maintain a security clearance.

PREFERRED:

  • A Bachelor’s Degree in Mechanical Engineering or Material Sciences from a four-year college or university and a minimum of Eight (8) + years of IC packaging related experience and/or training is required.
  • A Master’s Degree (MSME), in engineering, or other physical science with a minimum of Five (5) + years of IC packaging related experience and/or training is highly desirable.
  • Experience in one or more of the following tools - SolidWorks, Pro-E, Auto CAD or Bentley MicroStation, ICEMAX, Cadence APD, ANSYS, HFSS, and SI Wave or similar applications.

 

Salary Range: $96,527-126,691 annually. Applicable pay within the posted range may vary based on factors including, but not limited to, geographical location, job function of the position, education, and experience of the successful candidate.

CAES provides a variety of benefits including health insurance coverage, life and disability insurance, 401K, paid holidays and paid time off (PTO). Learn about Total Rewards and Benefits: www.cobhamrecruits.com (login: Recruit / password: benefits1)

CAES is an Equal Opportunity/Affirmative Action Employer and embraces diversity in our employee population. It is the policy of CAES to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or genetic information. CAES will refrain from discharging, or otherwise discriminating against, employees or applicants who inquire about, discuss, or disclose their compensation or the compensation of other employees or applicants.

 

The EEO is the Law poster is available here and the poster supplement is available here.

 

The Pay Transparency Policy is available here

 

CAES is committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation due to a disability for any part of the employment process, please send an e-mail to CAEScareers@caes.com and let us know the nature of your request and your contact information.

Job Information

  • Job ID: 59387445
  • Location:
    Colorado Springs, Colorado, United States
  • Position Title: Principal Packaging Engineer
  • Company Name: CAES
  • Area of Focus: Aerospace, Avionics
  • Job Function: Electronic Packaging Engineer
  • Job Type: Full-Time
  • Job Duration: Indefinite
  • Min Education: BA/BS/Undergraduate
  • Min Experience: 5-7 Years
  • Salary: $96,527.00 - $126,691.00 (Yearly Salary)
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